<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>1665-3521</journal-id>
<journal-title><![CDATA[Superficies y vacío]]></journal-title>
<abbrev-journal-title><![CDATA[Superf. vacío]]></abbrev-journal-title>
<issn>1665-3521</issn>
<publisher>
<publisher-name><![CDATA[Sociedad Mexicana de Ciencia y Tecnología de Superficies y Materiales A.C.]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S1665-35212011000100001</article-id>
<title-group>
<article-title xml:lang="es"><![CDATA[Óxido de silicio SOG como dieléctrico de compuerta recocido a 200°C]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Domínguez-J.]]></surname>
<given-names><![CDATA[M. A.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Rosales-Q.]]></surname>
<given-names><![CDATA[P.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Torres-J.]]></surname>
<given-names><![CDATA[A.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Molina-R.]]></surname>
<given-names><![CDATA[J.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Moreno-M.]]></surname>
<given-names><![CDATA[M.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Zúñiga-I.]]></surname>
<given-names><![CDATA[C.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Calleja-A]]></surname>
<given-names><![CDATA[W.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Coyotl-M.]]></surname>
<given-names><![CDATA[Felipe]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
</contrib-group>
<aff id="A01">
<institution><![CDATA[,Instituto Nacional de Astrofísica, Óptica y Electrónica Departamento de Electrónica ]]></institution>
<addr-line><![CDATA[Puebla Pue.]]></addr-line>
<country>México</country>
</aff>
<aff id="A02">
<institution><![CDATA[,Universidad Politécnica de Tulancingo Hidalgo División de Ingenierías ]]></institution>
<addr-line><![CDATA[Hidalgo ]]></addr-line>
<country>México</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>03</month>
<year>2011</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>03</month>
<year>2011</year>
</pub-date>
<volume>24</volume>
<numero>1</numero>
<fpage>1</fpage>
<lpage>4</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_arttext&amp;pid=S1665-35212011000100001&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_abstract&amp;pid=S1665-35212011000100001&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_pdf&amp;pid=S1665-35212011000100001&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="es"><p><![CDATA[En este trabajo, se ha realizado la caracterización del oxido de silicio SOG (SOG-SiO2) depositado por la técnica sol-gel y recocido a 200 °C. Los resultados de la caracterización óptica y eléctrica muestran que los valores del índice de refracción (n) y de la constante dieléctrica (k) son muy cercanos a aquellos valores comúnmente reportados para el SiO2 crecido térmicamente. Nuestros resultados sugieren que el SOG-SiO2 recocido a 200 °C puede ser una alternativa para mejorar las características eléctricas de los transistores de película delgada (TFTs), entre otros dispositivos que son fabricados a bajas temperaturas.]]></p></abstract>
<abstract abstract-type="short" xml:lang="en"><p><![CDATA[Currently, the flexible electronics research field is of high interest because of the development of low cost products, such as solar cells and LCDs. Low temperature deposition processes are required in order to use flexible substrates. Nevertheless, the performance of the electronic devices built at temperatures below 350 °C is not as good as in CMOS technology. Thus, physical and electrical properties of semiconductor and insulator materials deposited at these low temperatures must be improved. In this work, characterization of SiO2 annealed at 200°C has been done. The optical and electrical characterization showed that the refractive index (n) and dielectric constant (k) values are similar to those of thermally grown SiO2. As can be observed, these results suggest that this SiO2 annealing at 200°C could be an alternative to improve electrical characteristics of TFTs, among other device applications.]]></p></abstract>
<kwd-group>
<kwd lng="es"><![CDATA[SOG-SIO2]]></kwd>
<kwd lng="es"><![CDATA[Dieléctico de compuerta]]></kwd>
<kwd lng="es"><![CDATA[Transistores de película delgada]]></kwd>
<kwd lng="es"><![CDATA[Porcesos a baja temperatura]]></kwd>
<kwd lng="en"><![CDATA[SOG-SIO2]]></kwd>
<kwd lng="en"><![CDATA[Gate dielectric]]></kwd>
<kwd lng="en"><![CDATA[Thin film transistors]]></kwd>
<kwd lng="en"><![CDATA[Low-temperature process]]></kwd>
</kwd-group>
</article-meta>
</front><body><![CDATA[  	    <p align="center"><font face="verdana" size="4"><b>&Oacute;xido de silicio SOG como diel&eacute;ctrico de compuerta recocido a 200&deg;C</b></font></p>  	    <p align="center"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="center"><font face="verdana" size="2"><b>M. A. Dom&iacute;nguez&#45;J.&ordf;, P. Rosales&#45;Q.<sup>*,</sup>&ordf;, A. Torres&#45;J.&ordf;, J. Molina&#45;R.<sup>1,</sup>&ordf;, M. Moreno&#45;M.&ordf;, C. Z&uacute;&ntilde;iga&#45;I.&ordf;, W. Calleja&#45;A&ordf;. and Felipe Coyotl&#45;M.<sup>b</sup></b></font></p>      <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><i>&ordf; Departamento de Electr&oacute;nica, Instituto Nacional de Astrof&iacute;sica, &Oacute;ptica y Electr&oacute;nica</i> <i>AP 51 &amp; 216, C.P 72000, Puebla, Pue., M&eacute;xico</i>. *<a href="mailto:prosales@inaoep.mx">prosales@inaoep.mx</a></font></p>  	    <p align="justify"><font face="verdana" size="2"><i><sup>b</sup></i> <i>Divisi&oacute;n de Ingenier&iacute;as, Universidad Polit&eacute;cnica de Tulancingo</i> <i>Hidalgo, M&eacute;xico, Tel/Fax: (775) 775&#45;8202</i></font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2">Recibido: 27 de septiembre de 2010;    <br> 	Aceptado: 16 de enero de 2011</font></p>     ]]></body>
<body><![CDATA[<p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Resumen</b></font></p>  	    <p align="justify"><font face="verdana" size="2">En este trabajo, se ha realizado la caracterizaci&oacute;n del oxido de silicio SOG (SOG&#45;SiO<sub>2</sub>) depositado por la t&eacute;cnica sol&#45;gel y recocido a 200 &deg;C. Los resultados de la caracterizaci&oacute;n &oacute;ptica y el&eacute;ctrica muestran que los valores del &iacute;ndice de refracci&oacute;n (<i>n</i>) y de la constante diel&eacute;ctrica (<i>k</i>) son muy cercanos a aquellos valores com&uacute;nmente reportados para el SiO<sub>2</sub> crecido t&eacute;rmicamente. Nuestros resultados sugieren que el SOG&#45;SiO<sub>2</sub> recocido a 200 &deg;C puede ser una alternativa para mejorar las caracter&iacute;sticas el&eacute;ctricas de los transistores de pel&iacute;cula delgada (TFTs), entre otros dispositivos que son fabricados a bajas temperaturas.</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Palabras clave:</b> SOG&#45;SIO2; Diel&eacute;ctico de compuerta; Transistores de pel&iacute;cula delgada; Porcesos a baja temperatura.</font></p> 	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p> 	    <p align="justify"><font face="verdana" size="2"><b>Abstract</b></font></p>         <p align="justify"><font face="verdana" size="2">Currently, the flexible electronics research field is of high interest because of the development of low cost products, such as solar cells and LCDs. Low temperature deposition processes are required in order to use flexible substrates. Nevertheless, the performance of the electronic devices built at temperatures below 350 &deg;C is not as good as in CMOS technology. Thus, physical and electrical properties of semiconductor and insulator materials deposited at these low temperatures must be improved. In this work, characterization of SiO<sub>2</sub> annealed at 200&deg;C has been done. The optical and electrical characterization showed that the refractive index (<i>n</i>) and dielectric constant (<i>k</i>) values are similar to those of thermally grown SiO<sub>2</sub>. As can be observed, these results suggest that this SiO<sub>2</sub> annealing at 200&deg;C could be an alternative to improve electrical characteristics of TFTs, among other device applications.</font></p>         <p align="justify"><font face="verdana" size="2"><b>Keywords:</b> SOG&#45;SIO2, Gate dielectric; Thin film transistors; Low&#45;temperature process.</font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><a href="/pdf/sv/v24n1/v24n1a1.pdf" target="_blank">DESCARGAR ART&Iacute;CULO EN FORMATO PDF</a></font></p>  	    ]]></body>
<body><![CDATA[<p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Referencias</b></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;1&#93;. P. C. Joshi, A. T. Voutsas, and J. W. Hartzell, Electrochem. Soc. Abs. 776, 215th meeting, (2009).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691421&pid=S1665-3521201100010000100001&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;2&#93;. Oh, J.H.; Kang, D.H.; Park, W.H.; Jang, J.; Chang, Y.J.; Choi, J.B.; Kim, C.W. IEEE&#45;EDL. <b>30</b>, 36 (2009).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691423&pid=S1665-3521201100010000100002&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;3&#93;. W. Luft and Y. S. Tsuo, Hydrogenated amorphous silicon alloy Deposition processes 1ed. (Marcel Dekker, Inc., 1993).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691425&pid=S1665-3521201100010000100003&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;4&#93;. <a href="https://www51.honeywell.com/sm/em/productsapplications/dielectrics/spin-on_glass.html?c=21" target="_blank">https://www51.honeywell.com/sm/em/productsapplications/dielectrics/spin&#45;on_glass.html?c=21</a></font>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691427&pid=S1665-3521201100010000100004&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --><!-- ref --><p align="justify"><font face="verdana" size="2">&#91;5&#93;. J. H. Cheon, J. H. Bae, W. G. Lee and J. Jang, IEEE&#45;EDL. <b>29</b>, 235 (2008).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691428&pid=S1665-3521201100010000100005&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;6&#93;. C. R. Kagan, P. Andry, Thin&#45;Film&#45;Transistors, 1ed. (Marcel Dekker, Inc., 2003).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691430&pid=S1665-3521201100010000100006&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;7&#93;. Sze S. M. VLSI Technology, 2 ed. (Wiley, 1984).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691432&pid=S1665-3521201100010000100007&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;8&#93;. Dosev D "Fabrication, Characterization and Modeling of Nanocrystalline Silicon Thin Film Transistor Obtained by Hot&#45; Wire Chemical Vapour Deposition" PhD Thesis. Barcelona: Universitat Politecnica de Catalunya 2003.    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691434&pid=S1665-3521201100010000100008&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;9&#93;. M. S. Shur, H. C. Slade, A. A.Owusu, and T. Ytterdal, J. Electrochem. Soc., <b>144</b>, 283 (1997).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691436&pid=S1665-3521201100010000100009&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;10&#93;.Y.D. Son, K. D. Yang, B. S. Bae, J. Jang, M. Hong and S.J. Kim, IEEE&#45;TED,<b>53</b>, 1260 (2006).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691438&pid=S1665-3521201100010000100010&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;11&#93;.C. Chang and Y. S. Wu, IEEE&#45;EDL, <b>30</b>,1176 (2009).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691440&pid=S1665-3521201100010000100011&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;12&#93;.J. H. Cheon, J. H. Bae, W. G. Lee and J. Jang, Electrochem. S&#45;S L., 11, H77 (2008).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691442&pid=S1665-3521201100010000100012&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;13&#93;.K. Belarbi, K. Kandoussi, I. Souleiman, C. Simon, N. Coulon and T. Mohammed&#45;Brahim. Phys. Status Solidi C, 7, 1152 (2010).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691444&pid=S1665-3521201100010000100013&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;14&#93;.Sung Hwan Kim et al. Phys. Status Solidi C, 7, 1136 (2010).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691446&pid=S1665-3521201100010000100014&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;15&#93;.Hideki Matsumura, Keisuke Ohdaira and Shogo Nishizaki. Phys. Status Solidi C, 7, 1132 (2010).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9691448&pid=S1665-3521201100010000100015&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Nota</b></font></p>  	    <p align="justify"><font face="verdana" size="2">The Editors thank to the Physics Department of the Centro de Investigaci&oacute;n y de Estudios Avanzados del IPN for the support in the publication of this issue, and the cooperation of M en C. Alejandra Garc&iacute;a Sotelo and Eng. Erasmo G&oacute;mez.</font></p>      ]]></body><back>
<ref-list>
<ref id="B1">
<label>1</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Joshi]]></surname>
<given-names><![CDATA[P. C.]]></given-names>
</name>
<name>
<surname><![CDATA[Voutsas]]></surname>
<given-names><![CDATA[A. T.]]></given-names>
</name>
<name>
<surname><![CDATA[Hartzell]]></surname>
<given-names><![CDATA[J. W.]]></given-names>
</name>
</person-group>
<source><![CDATA[Electrochem. Soc. Abs.]]></source>
<year>2009</year>
<volume>776</volume>
</nlm-citation>
</ref>
<ref id="B2">
<label>2</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Oh]]></surname>
<given-names><![CDATA[J.H.]]></given-names>
</name>
<name>
<surname><![CDATA[Kang]]></surname>
<given-names><![CDATA[D.H.]]></given-names>
</name>
<name>
<surname><![CDATA[Park]]></surname>
<given-names><![CDATA[W.H.]]></given-names>
</name>
<name>
<surname><![CDATA[Jang]]></surname>
<given-names><![CDATA[J]]></given-names>
</name>
<name>
<surname><![CDATA[Chang]]></surname>
<given-names><![CDATA[Y.J.]]></given-names>
</name>
<name>
<surname><![CDATA[Choi]]></surname>
<given-names><![CDATA[J.B.]]></given-names>
</name>
<name>
<surname><![CDATA[Kim]]></surname>
<given-names><![CDATA[C.W]]></given-names>
</name>
</person-group>
<source><![CDATA[IEEE-EDL]]></source>
<year>2009</year>
<volume>30</volume>
<page-range>36</page-range></nlm-citation>
</ref>
<ref id="B3">
<label>3</label><nlm-citation citation-type="book">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Luft]]></surname>
<given-names><![CDATA[W.]]></given-names>
</name>
<name>
<surname><![CDATA[Tsuo]]></surname>
<given-names><![CDATA[Y. S.]]></given-names>
</name>
</person-group>
<source><![CDATA[Hydrogenated amorphous silicon alloy Deposition processes]]></source>
<year>1993</year>
<publisher-name><![CDATA[Marcel Dekker, Inc.]]></publisher-name>
</nlm-citation>
</ref>
<ref id="B4">
<label>4</label><nlm-citation citation-type="">
<source><![CDATA[]]></source>
<year></year>
</nlm-citation>
</ref>
<ref id="B5">
<label>5</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Cheon]]></surname>
<given-names><![CDATA[J. H.]]></given-names>
</name>
<name>
<surname><![CDATA[Bae]]></surname>
<given-names><![CDATA[J. H.]]></given-names>
</name>
<name>
<surname><![CDATA[Lee]]></surname>
<given-names><![CDATA[W. G.]]></given-names>
</name>
<name>
<surname><![CDATA[Jang]]></surname>
<given-names><![CDATA[J.]]></given-names>
</name>
</person-group>
<source><![CDATA[IEEE-EDL]]></source>
<year>2008</year>
<volume>29</volume>
<page-range>235</page-range></nlm-citation>
</ref>
<ref id="B6">
<label>6</label><nlm-citation citation-type="book">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Kagan]]></surname>
<given-names><![CDATA[C. R.]]></given-names>
</name>
<name>
<surname><![CDATA[Andry]]></surname>
<given-names><![CDATA[P.]]></given-names>
</name>
</person-group>
<source><![CDATA[Thin-Film-Transistors]]></source>
<year>2003</year>
<publisher-name><![CDATA[Marcel Dekker, Inc.]]></publisher-name>
</nlm-citation>
</ref>
<ref id="B7">
<label>7</label><nlm-citation citation-type="book">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Sze]]></surname>
<given-names><![CDATA[S. M]]></given-names>
</name>
</person-group>
<source><![CDATA[VLSI Technology]]></source>
<year>1984</year>
<edition>2</edition>
<publisher-name><![CDATA[Wiley]]></publisher-name>
</nlm-citation>
</ref>
<ref id="B8">
<label>8</label><nlm-citation citation-type="">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Dosev]]></surname>
<given-names><![CDATA[D]]></given-names>
</name>
</person-group>
<source><![CDATA[Fabrication, Characterization and Modeling of Nanocrystalline Silicon Thin Film Transistor Obtained by Hot- Wire Chemical Vapour Deposition]]></source>
<year></year>
</nlm-citation>
</ref>
<ref id="B9">
<label>9</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Shur]]></surname>
<given-names><![CDATA[M. S.]]></given-names>
</name>
<name>
<surname><![CDATA[Slade]]></surname>
<given-names><![CDATA[H. C.]]></given-names>
</name>
<name>
<surname><![CDATA[Owusu]]></surname>
<given-names><![CDATA[A. A.]]></given-names>
</name>
<name>
<surname><![CDATA[Ytterdal]]></surname>
<given-names><![CDATA[T.]]></given-names>
</name>
</person-group>
<source><![CDATA[J. Electrochem. Soc.]]></source>
<year>1997</year>
<volume>144</volume>
<numero>283</numero>
<issue>283</issue>
</nlm-citation>
</ref>
<ref id="B10">
<label>10</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Son]]></surname>
<given-names><![CDATA[Y.D.]]></given-names>
</name>
<name>
<surname><![CDATA[Yang]]></surname>
<given-names><![CDATA[K. D.]]></given-names>
</name>
<name>
<surname><![CDATA[Bae]]></surname>
<given-names><![CDATA[B. S.]]></given-names>
</name>
<name>
<surname><![CDATA[Jang]]></surname>
<given-names><![CDATA[J.]]></given-names>
</name>
<name>
<surname><![CDATA[Hong]]></surname>
<given-names><![CDATA[M.]]></given-names>
</name>
<name>
<surname><![CDATA[Kim]]></surname>
<given-names><![CDATA[S.J.]]></given-names>
</name>
</person-group>
<source><![CDATA[IEEE-TED]]></source>
<year>2006</year>
<volume>53</volume>
<page-range>1260</page-range></nlm-citation>
</ref>
<ref id="B11">
<label>11</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Chang]]></surname>
<given-names><![CDATA[C.]]></given-names>
</name>
<name>
<surname><![CDATA[Wu]]></surname>
<given-names><![CDATA[Y. S.]]></given-names>
</name>
</person-group>
<source><![CDATA[IEEE-EDL]]></source>
<year>2009</year>
<volume>30</volume>
<page-range>1176</page-range></nlm-citation>
</ref>
<ref id="B12">
<label>12</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Cheon]]></surname>
<given-names><![CDATA[J. H.]]></given-names>
</name>
<name>
<surname><![CDATA[Bae]]></surname>
<given-names><![CDATA[J. H.]]></given-names>
</name>
<name>
<surname><![CDATA[Lee]]></surname>
<given-names><![CDATA[W. G.]]></given-names>
</name>
<name>
<surname><![CDATA[Jang]]></surname>
<given-names><![CDATA[J.]]></given-names>
</name>
</person-group>
<source><![CDATA[Electrochem. S-S L.]]></source>
<year>2008</year>
<volume>11</volume>
<page-range>H77</page-range></nlm-citation>
</ref>
<ref id="B13">
<label>13</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Belarbi]]></surname>
<given-names><![CDATA[K.]]></given-names>
</name>
<name>
<surname><![CDATA[Kandoussi]]></surname>
<given-names><![CDATA[K.]]></given-names>
</name>
<name>
<surname><![CDATA[Souleiman]]></surname>
<given-names><![CDATA[I.]]></given-names>
</name>
<name>
<surname><![CDATA[Simon]]></surname>
<given-names><![CDATA[C.]]></given-names>
</name>
<name>
<surname><![CDATA[Coulon]]></surname>
<given-names><![CDATA[N.]]></given-names>
</name>
<name>
<surname><![CDATA[Mohammed-Brahim]]></surname>
<given-names><![CDATA[T.]]></given-names>
</name>
</person-group>
<source><![CDATA[Phys. Status Solidi C]]></source>
<year>2010</year>
<volume>7</volume>
<page-range>1152</page-range></nlm-citation>
</ref>
<ref id="B14">
<label>14</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Sung Hwan]]></surname>
<given-names><![CDATA[Kim]]></given-names>
</name>
</person-group>
<source><![CDATA[Phys. Status Solidi C]]></source>
<year>2010</year>
<volume>7</volume>
<page-range>1136</page-range></nlm-citation>
</ref>
<ref id="B15">
<label>15</label><nlm-citation citation-type="journal">
<person-group person-group-type="author">
<name>
<surname><![CDATA[Matsumura]]></surname>
<given-names><![CDATA[Hideki]]></given-names>
</name>
<name>
<surname><![CDATA[Ohdaira]]></surname>
<given-names><![CDATA[Keisuke]]></given-names>
</name>
<name>
<surname><![CDATA[Nishizaki]]></surname>
<given-names><![CDATA[Shogo]]></given-names>
</name>
</person-group>
<source><![CDATA[Phys. Status Solidi C]]></source>
<year>2010</year>
<volume>7</volume>
<page-range>1132</page-range></nlm-citation>
</ref>
</ref-list>
</back>
</article>
