<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>1665-6423</journal-id>
<journal-title><![CDATA[Journal of applied research and technology]]></journal-title>
<abbrev-journal-title><![CDATA[J. appl. res. technol]]></abbrev-journal-title>
<issn>1665-6423</issn>
<publisher>
<publisher-name><![CDATA[Universidad Nacional Autónoma de México, Instituto de Ciencias Aplicadas y Tecnología]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S1665-64232005000300001</article-id>
<title-group>
<article-title xml:lang="en"><![CDATA[Monitoring of the pH using ISFET sensors in electroplating processes]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Alvarez Romero]]></surname>
<given-names><![CDATA[G. A.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Ramírez-Silva]]></surname>
<given-names><![CDATA[M. T.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Rojas-Hernández]]></surname>
<given-names><![CDATA[A.]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Hernández-Rodríguez]]></surname>
<given-names><![CDATA[P. R.]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
</contrib-group>
<aff id="A01">
<institution><![CDATA[,Universidad Autónoma Metropolitana  Departamento de Química]]></institution>
<addr-line><![CDATA[Iztapalapa Distrito Federal]]></addr-line>
<country>México</country>
</aff>
<aff id="A02">
<institution><![CDATA[,Instituto Politécnico Nacional Centro de Investigación y de Estudios Avanzados Departamento de Ingeniería Eléctrica]]></institution>
<addr-line><![CDATA[México Distrito Federal]]></addr-line>
<country>México</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>00</month>
<year>2005</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>00</month>
<year>2005</year>
</pub-date>
<volume>3</volume>
<numero>3</numero>
<fpage>163</fpage>
<lpage>168</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_arttext&amp;pid=S1665-64232005000300001&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_abstract&amp;pid=S1665-64232005000300001&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_pdf&amp;pid=S1665-64232005000300001&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="en"><p><![CDATA[It is well known that electroplating with metals has achieved quite a significant importance and has become a lucrative area. The present paper looks at the electroplating processes as a part of the metallurgical industry that are carried out with diverse aims. The quality and characteristics of the metal deposit depend on the electrochemical conditions imposed, such as pH. During an industrial electroplating process, when an undesirable change is detected first in the metal coating attained, is a common occurrence that a complete change of the plating bath is carried out. Due to this, the application of analytical systems to enable in situ precise monitoring of any compositional changes of the bath during the electroplating process, is an unquestionable need to be carefully satisfied. The design of such systems should allow close control of the concentrations of specific components during the process, constituting thus a desirable aim entailing both, financial and time savings. In the present work, the construction of an analytical system based on the coupling of a continuous sampling system with pH ISFET sensors is described. Comparative studies between a glass electrode and the proposed analytical system in copper, silver and nickel electroplating baths are carried out.]]></p></abstract>
<abstract abstract-type="short" xml:lang="es"><p><![CDATA[Es bien conocido que el electrodepósito de metales ha adquirido una importancia significante como actividad industrial y que representa un área especialmente lucrativa. La calidad y características del depósito metálico dependen de las condiciones electroquímicas impuestas especialmente del pH. Durante electrodepósitos industriales, cuando se detectan los primeros cambios indeseables en el depóstido metálico, es muy común detener el proceso para la completa sustitución del baño de electrodepósito. Lo anterior hace incuestionable la importancia de la aplicación de sistemas de análisis en el monitoreo in situ de cambios en los componentes del baño durante el proceso de electrodepósito. Estos sistemas permitirían el control y ajuste de las concentraciones de los componentes específicos durante el proceso lo que se traduce en ahorros tanto económico como de tiempo. En el presente trabajo se describe la construcción de un sistema de análisis basado en el acoplamiento de un sistema de muestreo continuo con sensores al pH tipo ISFET. Se realizan estudios comparativos entre un electrodo de vidrio y el sistema de análisis propuesto en el monitoreo de baños de depósito de cobre, plata y niquel]]></p></abstract>
<kwd-group>
<kwd lng="en"><![CDATA[ISFET]]></kwd>
<kwd lng="en"><![CDATA[Electroplating]]></kwd>
<kwd lng="en"><![CDATA[Sensor]]></kwd>
</kwd-group>
</article-meta>
</front><body><![CDATA[  	    <p align="center"><font face="verdana" size="4"><b>Monitoring of the pH using ISFET sensors in electroplating processes</b></font></p>     <p align="center">&nbsp;</p>  	    <p align="center"><b><font face="verdana" size="2">Alvarez Romero, G. A.<sup>1</sup>, Ram&iacute;rez&#45;Silva, M. T.<sup>1</sup>, Rojas&#45;Hern&aacute;ndez, A.<sup>1</sup>, Hern&aacute;ndez&#45;Rodr&iacute;guez, P. R.<sup>2</sup></font></b></p>     <p align="center">&nbsp;</p>  	    <p align="justify"><font face="verdana" size="2"><sup>1</sup> <i>Universidad Aut&oacute;noma Metropolitana&#45;Iztapalapa. Departamento de Qu&iacute;mica. &Aacute;rea de Qu&iacute;mica Anal&iacute;tica. Av. San Rafael Atlixco #86, Col. Vicentina, C.P. 09340. M&eacute;xico, D.F.</i></font></p>  	    <p align="justify"><font face="verdana" size="2"><sup>2</sup> <i>CINVESTAV&#45;Instituto Polit&eacute;cnico Nacional. Secci&oacute;n de Bioelectr&oacute;nica. Depto de Ing. El&eacute;ctrica. Av. IPN 2508, Col. Zacatenco, C.P. 07300, M&eacute;xico, D.F</i>. <a href="mailto:mtrs218@xanum.uam.mx">mtrs218@xanum.uam.mx</a></font></p>     <p align="justify">&nbsp;</p>  	    <p align="justify"><font face="verdana" size="2">Received: November 18<sup>th</sup>, 2002.    <br> Accepted: July 1<sup>th</sup>, 2005.</font></p> 	    ]]></body>
<body><![CDATA[<p align="justify">&nbsp;</p> 	    <p align="justify"><font face="verdana" size="2"> <b>Abstract</b></font></p>  	    <p align="justify"><font face="verdana" size="2">It is well known that electroplating with metals has achieved quite a significant importance and has become a lucrative area. The present paper looks at the electroplating processes as a part of the metallurgical industry that are carried out with diverse aims. The quality and characteristics of the metal deposit depend on the electrochemical conditions imposed, such as pH. During an industrial electroplating process, when an undesirable change is detected first in the metal coating attained, is a common occurrence that a complete change of the plating bath is carried out. Due to this, the application of analytical systems to enable in situ precise monitoring of any compositional changes of the bath during the electroplating process, is an unquestionable need to be carefully satisfied. The design of such systems should allow close control of the concentrations of specific components during the process, constituting thus a desirable aim entailing both, financial and time savings. In the present work, the construction of an analytical system based on the coupling of a continuous sampling system with pH ISFET sensors is described. Comparative studies between a glass electrode and the proposed analytical system in copper, silver and nickel electroplating baths are carried out.</font></p> 	    <p align="justify"><font face="verdana" size="2"><b>Keywords:</b> ISFET, Electroplating, Sensor.</font></p>     <p align="justify">&nbsp;</p>  	    <p align="justify"><font face="verdana" size="2"><b>Resumen</b></font></p>  	    <p align="justify"><font face="verdana" size="2">Es bien conocido que el electrodep&oacute;sito de metales ha adquirido una importancia significante como actividad industrial y que representa un &aacute;rea especialmente lucrativa. La calidad y caracter&iacute;sticas del dep&oacute;sito met&aacute;lico dependen de las condiciones electroqu&iacute;micas impuestas especialmente del pH. Durante electrodep&oacute;sitos industriales, cuando se detectan los primeros cambios indeseables en el dep&oacute;stido met&aacute;lico, es muy com&uacute;n detener el proceso para la completa sustituci&oacute;n del ba&ntilde;o de electrodep&oacute;sito. Lo anterior hace incuestionable la importancia de la aplicaci&oacute;n de sistemas de an&aacute;lisis en el monitoreo in situ de cambios en los componentes del ba&ntilde;o durante el proceso de electrodep&oacute;sito. Estos sistemas permitir&iacute;an el control y ajuste de las concentraciones de los componentes espec&iacute;ficos durante el proceso lo que se traduce en ahorros tanto econ&oacute;mico como de tiempo. En el presente trabajo se describe la construcci&oacute;n de un sistema de an&aacute;lisis basado en el acoplamiento de un sistema de muestreo continuo con sensores al pH tipo ISFET. Se realizan estudios comparativos entre un electrodo de vidrio y el sistema de an&aacute;lisis propuesto en el monitoreo de ba&ntilde;os de dep&oacute;sito de cobre, plata y niquel.</font></p>  	    <p align="justify">&nbsp;</p> 	    <p align="justify"><font size="2" face="verdana"><a href="/pdf/jart/v3n3/v3n3a1.pdf" target="_blank">DESCARGAR ART&Iacute;CULO EN FORMATO PDF</a></font></p> 	    <p align="justify">&nbsp;</p>  	    ]]></body>
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