<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>1665-3521</journal-id>
<journal-title><![CDATA[Superficies y vacío]]></journal-title>
<abbrev-journal-title><![CDATA[Superf. vacío]]></abbrev-journal-title>
<issn>1665-3521</issn>
<publisher>
<publisher-name><![CDATA[Sociedad Mexicana de Ciencia y Tecnología de Superficies y Materiales A.C.]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S1665-35212011000200003</article-id>
<title-group>
<article-title xml:lang="es"><![CDATA[Sincronización de Circuitos Integrados complejos CMOS]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Linares Aranda]]></surname>
<given-names><![CDATA[Mónico]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[González Díaz]]></surname>
<given-names><![CDATA[Oscar]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Salim Maza]]></surname>
<given-names><![CDATA[Manuel]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
</contrib-group>
<aff id="A01">
<institution><![CDATA[,Instituto Nacional de Astrofísica, Óptica y Electrónica  ]]></institution>
<addr-line><![CDATA[Cholula Pue.]]></addr-line>
<country>México</country>
</aff>
<aff id="A02">
<institution><![CDATA[,Freescale Semiconductor México Complejo Intermex Suite E ]]></institution>
<addr-line><![CDATA[Tlaquepaque Jalisco]]></addr-line>
<country>México</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>06</month>
<year>2011</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>06</month>
<year>2011</year>
</pub-date>
<volume>24</volume>
<numero>2</numero>
<fpage>43</fpage>
<lpage>53</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_arttext&amp;pid=S1665-35212011000200003&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_abstract&amp;pid=S1665-35212011000200003&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_pdf&amp;pid=S1665-35212011000200003&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="es"><p><![CDATA[Debido a la tendencia de integrar diversos subsistemas electrónicos y mecánicos complejos en un solo circuito integrado, es necesario alternativas de temporización y sincronización eficientes en velocidad, consumo de potencia y área. En este artículo se propone el uso de osciladores de anillo interconectados y acoplados como redes de generación y distribución de señales de reloj, para la sincronización de sistemas integrados en un mismo chip. Se presentan resultados de simulación HSPICE de redes convencionales y no convencionales diseñadas utilizando parámetros típicos de dos procesos de fabricación de circuitos integrados CMOS pozo N Austria Micro Systems (AMS) 0.35 &#956;m y Berkeley 0.13 &#956;m. En base a resultados experimentales obtenidos de redes de distribución de reloj locales y globales fabricadas con el proceso CMOS de 0.35 &#956;m de AMS, se demuestra que los anillos interconectados y acoplados representan una aproximación apropiada para sistemas integrados en un solo circuito de silicio debido a su buen desempeño, escalabilidad con la tecnología, bajo corrimiento al reloj, alta velocidad, tolerancia a fallas y robustez a variaciones del proceso de fabricación.]]></p></abstract>
<abstract abstract-type="short" xml:lang="en"><p><![CDATA[Due to the trend of integrating various complex electronic and mechanical subsystems in a single integrated circuit or chip, timing and synchronization alternatives efficient in speed, power consumption, and area are needed. In this paper, the use of interconnected and coupled ring oscillators as clock generation and distribution networks for the synchronization of integrated systems in a single chip is proposed. The HSPICE simulation results of the conventional and no-conventional networks designed using typical parameters of two integrated circuit fabrication processes (N-well Austriamicrosystems 0.35 &#956;m CMOS and Berkeley 0.13 &#956;m) are presented. Based on the experimental results obtained from local and global clock distribution networks fabricated in Austriamicrosystems 0.35 &#956;m process, it was demonstrated that the interconnected and coupled ring oscillators represent a good approach for integrated systems in a single silicon chip due to its good performance, scalability with technology, low time uncertainty, high speed, fault tolerance, and robustness to process variations.]]></p></abstract>
<kwd-group>
<kwd lng="es"><![CDATA[Circuitos integrados]]></kwd>
<kwd lng="es"><![CDATA[Osciladores]]></kwd>
<kwd lng="es"><![CDATA[Redes de reloj]]></kwd>
<kwd lng="es"><![CDATA[Sincronización]]></kwd>
<kwd lng="en"><![CDATA[Integrated circuits]]></kwd>
<kwd lng="en"><![CDATA[Oscillators]]></kwd>
<kwd lng="en"><![CDATA[Clock networks]]></kwd>
<kwd lng="en"><![CDATA[Synchronization]]></kwd>
</kwd-group>
</article-meta>
</front><body><![CDATA[  	    <p align="center"><font face="verdana" size="4"><b>Sincronizaci&oacute;n de Circuitos Integrados complejos CMOS</b></font></p>  	    <p align="center"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="center"><font face="verdana" size="2"><b>Linares Aranda M&oacute;nico<sup>1,</sup>&ordf; Gonz&aacute;lez D&iacute;az Oscar<sup>2,</sup> &ordf; y Salim Maza Manuel<sup>2, b</sup></b></font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><i>&ordf; Instituto Nacional de Astrof&iacute;sica, &Oacute;ptica y Electr&oacute;nica, INAOE Lu&iacute;s Enrique Erro 1. Tonantzintla, Cholula, Pue. M&eacute;xico C.P. 72840.</i> <sup>1</sup><a href="mailto:mlinares@inaoep.mx">mlinares@inaoep.mx</a>, <sup>2</sup><a href="mailto:ogonzalez@susu.inaoep.mx">ogonzalez@susu.inaoep.mx</a></font></p>  	    <p align="justify"><font face="verdana" size="2"><i><sup>b</sup> Freescale Semiconductor M&eacute;xico. Complejo Intermex Suite E Perif&eacute;rico Sur 7999, Sta. Ma. Tlaquepaque, Jalisco, M&eacute;xico. C.P. 45601.</i> <a href="mailto:msalimm@freescale.mx">msalimm@freescale.mx</a></font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2">Recibido: 29 de septiembre de 2010;    <br> 	Aceptado: 29 de abril de 2011</font></p>  	    ]]></body>
<body><![CDATA[<p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Resumen</b></font></p>  	    <p align="justify"><font face="verdana" size="2">Debido a la tendencia de integrar diversos subsistemas electr&oacute;nicos y mec&aacute;nicos complejos en un solo circuito integrado, es necesario alternativas de temporizaci&oacute;n y sincronizaci&oacute;n eficientes en velocidad, consumo de potencia y &aacute;rea. En este art&iacute;culo se propone el uso de osciladores de anillo interconectados y acoplados como redes de generaci&oacute;n y distribuci&oacute;n de se&ntilde;ales de reloj, para la sincronizaci&oacute;n de sistemas integrados en un mismo chip. Se presentan resultados de simulaci&oacute;n HSPICE de redes convencionales y no convencionales dise&ntilde;adas utilizando par&aacute;metros t&iacute;picos de dos procesos de fabricaci&oacute;n de circuitos integrados CMOS pozo N Austria Micro Systems (AMS) 0.35 &#956;m y Berkeley 0.13 &#956;m. En base a resultados experimentales obtenidos de redes de distribuci&oacute;n de reloj locales y globales fabricadas con el proceso CMOS de 0.35 &#956;m de AMS, se demuestra que los anillos interconectados y acoplados representan una aproximaci&oacute;n apropiada para sistemas integrados en un solo circuito de silicio debido a su buen desempe&ntilde;o, escalabilidad con la tecnolog&iacute;a, bajo corrimiento al reloj, alta velocidad, tolerancia a fallas y robustez a variaciones del proceso de fabricaci&oacute;n.</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Palabras clave:</b> Circuitos integrados; Osciladores; Redes de reloj; Sincronizaci&oacute;n.</font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Abstract</b></font></p>  	    <p align="justify"><font face="verdana" size="2">Due to the trend of integrating various complex electronic and mechanical subsystems in a single integrated circuit or chip, timing and synchronization alternatives efficient in speed, power consumption, and area are needed. In this paper, the use of interconnected and coupled ring oscillators as clock generation and distribution networks for the synchronization of integrated systems in a single chip is proposed. The HSPICE simulation results of the conventional and no&#45;conventional networks designed using typical parameters of two integrated circuit fabrication processes (N&#45;well Austriamicrosystems 0.35 &#956;m CMOS and Berkeley 0.13 &#956;m<i>)</i> are presented. Based on the experimental results obtained from local and global clock distribution networks fabricated in Austriamicrosystems 0.35 &#956;m process, it was demonstrated that the interconnected and coupled ring oscillators represent a good approach for integrated systems in a single silicon chip due to its good performance, scalability with technology, low time uncertainty, high speed, fault tolerance, and robustness to process variations.</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Keywords:</b> Integrated circuits; Oscillators; Clock networks; Synchronization.</font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><a href="/pdf/sv/v24n2/v24n2a3.pdf" target="_blank">DESCARGAR ART&Iacute;CULO EN FORMATO PDF</a></font></p>  	    ]]></body>
<body><![CDATA[<p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Agradecimientos</b></font></p>  	    <p align="justify"><font face="verdana" size="2">Al Consejo Nacional de Ciencia y Tecnolog&iacute;a por el apoyo a trav&eacute;s del proyecto 51511&#45;Y.</font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Referencias</b></font></p>  	    <!-- ref --><p align="justify"><font face="verdana" size="2">&#91;1&#93;. H.B. Bakoglu. Circuits, interconnections, and packaging for VLSI. 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Microwave Symposium Digest, 2006. IEEE MTT&#45;S International. 573 (2006).    &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;[&#160;<a href="javascript:void(0);" onclick="javascript: window.open('/scielo.php?script=sci_nlinks&ref=9751156&pid=S1665-3521201100020000300019&lng=','','width=640,height=500,resizable=yes,scrollbars=1,menubar=yes,');">Links</a>&#160;]<!-- end-ref --></font></p>  	    <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>  	    <p align="justify"><font face="verdana" size="2"><b>Nota</b></font></p>  	    <p align="justify"><font face="verdana" size="2">The Editors thank to the Physics Department of the Centro de Investigaci&oacute;n y de Estudios Avanzados del IPN for the support in the publication of this issue, and the cooperation of M en C. Alejandra Garc&iacute;a Sotelo and Eng. Erasmo G&oacute;mez.</font></p>      ]]></body><back>
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