<?xml version="1.0" encoding="ISO-8859-1"?><article xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">
<front>
<journal-meta>
<journal-id>1870-3542</journal-id>
<journal-title><![CDATA[Revista mexicana de física E]]></journal-title>
<abbrev-journal-title><![CDATA[Rev. mex. fís. E]]></abbrev-journal-title>
<issn>1870-3542</issn>
<publisher>
<publisher-name><![CDATA[Sociedad Mexicana de Física]]></publisher-name>
</publisher>
</journal-meta>
<article-meta>
<article-id>S1870-35422008000100003</article-id>
<title-group>
<article-title xml:lang="en"><![CDATA[Thermal model for a microhot plate used in a MEM gas sensor]]></article-title>
</title-group>
<contrib-group>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Reyes-Barranca]]></surname>
<given-names><![CDATA[M. Alfredo]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[González-Vidal]]></surname>
<given-names><![CDATA[J.L]]></given-names>
</name>
<xref ref-type="aff" rid="A02"/>
</contrib>
<contrib contrib-type="author">
<name>
<surname><![CDATA[Tavira-Fuentes]]></surname>
<given-names><![CDATA[A]]></given-names>
</name>
<xref ref-type="aff" rid="A01"/>
</contrib>
</contrib-group>
<aff id="A01">
<institution><![CDATA[,CINVESTAV-IPN Department of Electrical Engineering ]]></institution>
<addr-line><![CDATA[MÉXICO D.F.]]></addr-line>
<country>México</country>
</aff>
<aff id="A02">
<institution><![CDATA[,Universidad Autónoma del Estado de Hidalgo C.I.T.I.S. ]]></institution>
<addr-line><![CDATA[Pachuca Hidalgo]]></addr-line>
<country>México</country>
</aff>
<pub-date pub-type="pub">
<day>00</day>
<month>06</month>
<year>2008</year>
</pub-date>
<pub-date pub-type="epub">
<day>00</day>
<month>06</month>
<year>2008</year>
</pub-date>
<volume>54</volume>
<numero>1</numero>
<fpage>15</fpage>
<lpage>24</lpage>
<copyright-statement/>
<copyright-year/>
<self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_arttext&amp;pid=S1870-35422008000100003&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_abstract&amp;pid=S1870-35422008000100003&amp;lng=en&amp;nrm=iso"></self-uri><self-uri xlink:href="http://www.scielo.org.mx/scielo.php?script=sci_pdf&amp;pid=S1870-35422008000100003&amp;lng=en&amp;nrm=iso"></self-uri><abstract abstract-type="short" xml:lang="en"><p><![CDATA[A thermal analytical model for a MEM gas sensor is presented and compared with an electrical circuit equivalent model. The objective is to study the temperature performance of the microhot plate configured within a MEM structure used for gas sensing. From this, it is possible to determine the magnitude of the electrical current that must be applied to the polysilicon heater on regard of its dimensions and materials used, for instance, when the sensor structure is fabricated with a MEMS technology compatible with CMOS integrated circuits fabrication. Results are presented where the response time and temperature level, as a function of applied current, can be determined. The model presented can be used as a base for designing microhot plates operating in gas sensors, where temperatures in the order of 300° C are needed and that will be integrated monolithically with associated electronics, with constraints as minimum power dissipation]]></p></abstract>
<abstract abstract-type="short" xml:lang="es"><p><![CDATA[En este trabajo se presenta un modelo analítico térmico para un microsensor de gas MEM y, además se compara con un modelo de circuito eléctrico equivalente, con el objetivo de estudiar el comportamiento térmico de una micro placa caliente de una estructura MEM utilizada en el sensado de gases. Por lo anterior, es posible determinar la magnitud de la corriente eléctrica que debe ser aplicada a un micro calefactor de polisilicio, considerando sus dimensiones y los materiales utilizados; por ejemplo, cuando la estructura del sensor es fabricada con tecnología MEMS, la cual es compatible con la fabricación de circuitos integrados CMOS. Los resultados mostrados son el tiempo de respuesta y nivel de temperatura como función de la temperatura corriente aplicada. El modelo presentado puede ser aplicado como base para el diseño de micro placas calientes usadas en sensores de gases, donde se necesitan temperaturas en el orden de los 300°C, dichos sensores de gas seran integrados monolíticamente con su electrónica asociada correspondiente, considerando un consumo de potencia mínima]]></p></abstract>
<kwd-group>
<kwd lng="en"><![CDATA[MEMS]]></kwd>
<kwd lng="en"><![CDATA[microhot plate]]></kwd>
<kwd lng="en"><![CDATA[thermal conductivity]]></kwd>
<kwd lng="en"><![CDATA[electro-thermal response]]></kwd>
<kwd lng="es"><![CDATA[MEMS]]></kwd>
<kwd lng="es"><![CDATA[microplaca caliente]]></kwd>
<kwd lng="es"><![CDATA[conductividad térmica]]></kwd>
<kwd lng="es"><![CDATA[respuesta electrotérmica]]></kwd>
</kwd-group>
</article-meta>
</front><body><![CDATA[ <p align="justify"><font face="verdana" size="4">Ense&ntilde;anza</font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     <p align="center"><font face="verdana" size="4"><b>Thermal model for a microhot plate used in a MEM gas sensor</b></font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     <p align="center"><font face="verdana" size="2"><b>M. Alfredo Reyes&#150;Barranca&ordf;, J.L. Gonz&aacute;lez&#150;Vidal<sup>b</sup>, and A. Tavira&#150;Fuentes&ordf;</b></font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     <p align="justify"><font face="verdana" size="2"><i>&ordf; Department of Electrical Engineering, CINVESTAV&#150;IPN, M&Eacute;XICO, D.F., M&eacute;xico.</i></font></p>     <p align="justify"><font face="verdana" size="2"><i><sup>b</sup> C.I.T.I.S., Universidad Aut&oacute;noma del Estado de Hidalgo, Carretera Pachuca&#150;Tulancingo Km. 4.5, Pachuca Hidalgo, M&eacute;xico 42076. </i>e&#150;mail: <a href="mailto:mreyes@cinvestav.mx">mreyes@cinvestav.mx</a></font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     <p align="justify"><font face="verdana" size="2">Recibido el 3 de mayo de 2007    ]]></body>
<body><![CDATA[<br> Aceptado el 28 de junio de 2007</font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     <p align="justify"><font face="verdana" size="2"><b>Abstract</b></font></p>     <p align="justify"><font face="verdana" size="2">A thermal analytical model for a MEM gas sensor is presented and compared with an electrical circuit equivalent model. The objective is to study the temperature performance of the microhot plate configured within a MEM structure used for gas sensing. From this, it is possible to determine the magnitude of the electrical current that must be applied to the polysilicon heater on regard of its dimensions and materials used, for instance, when the sensor structure is fabricated with a MEMS technology compatible with CMOS integrated circuits fabrication. Results are presented where the response time and temperature level, as a function of applied current, can be determined. The model presented can be used as a base for designing microhot plates operating in gas sensors, where temperatures in the order of 300&deg; C are needed and that will be integrated monolithically with associated electronics, with constraints as minimum power dissipation.</font></p>     <p align="justify"><font face="verdana" size="2"><b>Keywords: </b>MEMS; microhot plate; thermal conductivity; electro&#150;thermal response.</font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     <p align="justify"><font face="verdana" size="2"><b>Resumen</b></font></p>     <p align="justify"><font face="verdana" size="2">En este trabajo se presenta un modelo anal&iacute;tico t&eacute;rmico para un microsensor de gas MEM y, adem&aacute;s se compara con un modelo de circuito el&eacute;ctrico equivalente, con el objetivo de estudiar el comportamiento t&eacute;rmico de una micro placa caliente de una estructura MEM utilizada en el sensado de gases. Por lo anterior, es posible determinar la magnitud de la corriente el&eacute;ctrica que debe ser aplicada a un micro calefactor de polisilicio, considerando sus dimensiones y los materiales utilizados; por ejemplo, cuando la estructura del sensor es fabricada con tecnolog&iacute;a MEMS, la cual es compatible con la fabricaci&oacute;n de circuitos integrados CMOS. Los resultados mostrados son el tiempo de respuesta y nivel de temperatura como funci&oacute;n de la temperatura corriente aplicada. El modelo presentado puede ser aplicado como base para el dise&ntilde;o de micro placas calientes usadas en sensores de gases, donde se necesitan temperaturas en el orden de los 300&deg;C, dichos sensores de gas seran integrados monol&iacute;ticamente con su electr&oacute;nica asociada correspondiente, considerando un consumo de potencia m&iacute;nima.</font></p>     <p align="justify"><font face="verdana" size="2"><b>Descriptores: </b>MEMS; microplaca caliente; conductividad t&eacute;rmica; respuesta electrot&eacute;rmica.</font></p>     <p align="justify"><font face="verdana" size="2">&nbsp;</font></p>     ]]></body>
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