Regular papers

 

An Extended Payment Model for M–Commerce with Fair Non–Repudiation Protocols

 

Tran Khanh DANG¹ and Thi Thanh Huyen PHAN²

 

¹ Faculty of Computer Science & Engineering, HCMC University of Technology, VNUHCM, Ho Chi Minh City, Vietnam (phone:+84–8–38647256, ext. 5841, e–mail: khanh@cse.hcmut.edu.vn).

² Faculty of Computer Science & Engineering, HCMC University of Technology, VNUHCM, Ho Chi Minh City, Vietnam (phone:+84–8–38647256, ext. 5842, e–mail: huyenttp@cse.hcmut.edu.vn).

 

Manuscript received June 29, 2009.
Manuscript accepted for publication November 17, 2009.

 

Abstract

Non–repudiation in e–commerce has recently gained a lot of interest but its successor brother, non–repudiation in m–commerce, is still at the start. In this paper, we propose an extension of existing mobile payment models to introduce an extended mobile payment service (EMPS) model, which is based on assumptions about the cooperation between mobile network operators and financial institutions to deal with different payment amounts ranging from micro to macro payment. The novel model focuses on enhancement of non–repudiation problem. Fair non–repudiation protocols are developed for not only payment phase but also other phases in a typical m–commerce transaction, including price negotiation and content delivery. Joint signatures method is used in protocols to overcome the limitations in mobile handheld device capability and to reduce the trust dependence totally on the payment service. As with the proposed non–repudiation protocols, EMPS plays the role of a semi–trusted third party and is an indispensable factor for creating the fairness property. Non–repudiation analyses of these protocols are also conducted besides some guidelines for ensuring non–repudiation in m–commerce.

Key words: Communication system security, M–commerce security, non–repudiation, semi–trusted 3^rd party, payment model.

 

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NOTE

This work was supported in part by Advances in Security & Information Systems (ASIS) Lab, Faculty of Computer Science & Engineering, HCMUT, Vietnam.