Packaging investigation and study for optical interfacing of micro components with optical fibers – Part II

 

Jose Mireles Jr.*, Maribel Gómez, Miguel A. Garcia

 

Centro de Investigación en Ciencia y Tecnología Aplicada (CICTA) Universidad Autónoma de Ciudad Juárez Ave. Del Charro 450 N., Cd. Juarez Chih. MEXICO, CP 32310. *jmireles@uacj.mx

 

Recibido: 12 de febrero de 2007.
Aceptado: 16 de mayo de 2007.

 

Abstract

An investigation study concerning optical fiber alignment and micro–mirror performance in MOEMS devices is being reviewed in this paper. The central attention of the study is the analysis of optical fibers positioning, alignment, bonding, optical improvements, coupling to micro–lenses for beam collimation and waveguides. Also, we highlight features concerning coupling of optical fibers to micro–mirrors while searching for the proper alignment and characterization of the optical beam reflection, its tolerances, relative positioning, and attachment techniques. This Part II presents assembly procedures and experiments considering the first Part I of this work.

Keywords: MicroElectroMechanical Systems (MEMS); Packaging; Optical interconnects; OptoElectronics.

 

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References

[1] MANCEF, Second Edition of International Micro–Nano Roadmap, Micro and Nanotechnology Commercialization Education Foundation, (Albuquerque, NM 87106 USA, 2004).         [ Links ]

[2] C. Iliescu; M. Jianmin; F.E.H. Tay, Electronics Packaging Technology, 2003 5th Conference, EPTC 2003, (2003).         [ Links ]

[3] Reichl, H.; Grosser, V., The 14th IEEE International Conference on Micro Electro Mechanical Systems, 2001. MEMS 2001. (2001).         [ Links ]

[4] E. J. Palen, Proceedings from IEEE's Photonic Devices & Systems Packaging Symposium (PhoPack), (Stanford University, California, 2002).         [ Links ]

[5] Mireles J., Report document #9602, PO# 659783. Applied Science and Technology Research Center, (Autonomous University of Juarez, MÉXICO 2007).         [ Links ]

[6] S.–S. Lee, L.–S. Huang, C.–J. Kim, and M. C. Wu, Solid–State Sensor and Actuator Workshop, (Hilton Head Island, SC. 1998).         [ Links ]

[7] J.A. Dziuban, Bonding in Microsystem Technology, Springer 2006, ISBN 1437–0387. (2006).         [ Links ]

[8] Y. G. Lee, S. K. Hong, M. Y. Park, S. C. Jung and S. H. Lee, MOEMS and Miniaturized Systems IV, Proceedings of SPIE Vol. 5346, (SPIE, Bellingham, WA, 2004) p. 160.         [ Links ]

[9] E. Palen, Photonics Packaging, Integration, and Interconnects VII, Proc. of SPIE Vol. 6478, 647804, (2007).         [ Links ]

[10] S. Kawai, Handbook of Optical Interconnects, Taylor Francis, ISBN 0–8247–2441–0. (2005).         [ Links ]

[11] T.H. Buckle, Sandia National Laboratories Report SAND93–2478. (Albuquerque NM, 1993).         [ Links ]

[12] S. Ou, G. Xu, Y. Xu, K.N. Tu, Ceramics International Vol. 30 Issue 7, (2004) p. 1115.         [ Links ]

[13] J. Mireles, M. Gomez, M.A. Garcia "Packaging investigation and study for optical interfacing of micro components with optical fibers – Part I" Superficies y Vacío 20(1), 21–33, March 2007.         [ Links ]