Resumo

NAVARRO, L.A.; PERPINA, X.; VELLVEHI, M.  e  JORDA, X.. Silver nano-particles sintering process for the die-attach of power devices for high temperature applications. Ingenier. mecáni. tecnolog. desarroll [online]. 2012, vol.4, n.3, pp.97-102. ISSN 1665-7381.

Die-attach layer is one of the most critical elements for high-temperature power electronics applications. The increase in operating temperature requires new materials with higher melting points and suitable thermo-mechanical properties. Among the possible solutions, sintering of Ag nano-scale particles is an interesting method, because it requires moderate (<300°C) process temperatures. The aim of this work is the implementation and experimental evaluation of nano-Ag sintering for the die-attach of semiconductor power devices, directly on Cu substrates. The experimental evaluation of the die-attach integrity will be performed using test vehicles and die-shear analysis tools. In this paper, processing methodology, analysis of some parameters that influence the process and die-shear results of nano-Ag sintered samples, will be presented.

Palavras-chave : silver nano-sintering; die-attach; packaging; power devices.

        · resumo em Espanhol     · texto em Espanhol     · Espanhol ( pdf )